


공정장비 검색
Secondary Ion Mass Spectrometry (SIMS)
3차원 프로파일러3D Profiler
4단 면저항 측정기-14 Point Probe - 1
8인치 트렉 시스템-1 (SVS)PR Track_SVS - 1
8인치 트렉 시스템-2 (SVS)PR Track_SVS - 2
8인치 트렉 시스템-3 (SVS)PR Track_SVS - 3
가시/자외선/근적외선 분광광도계UV/Vis/nIR Spectrometer
감광막 도포 시스템PR Spin Coater_Sawatec
감광제 제거 시스템-ⅡPR Asher_FEOL - 2
감광제 제거 시스템-IPR Asher_FEOL - 1
고분해능 전계방출형 주사전자현미경High Resolution FE-SEM-Ⅳ (JSM-IT710HR)
고온 습식/건식 산화로Furnace Oxidation_LEAD
고온열처리로-IIFurnace High Temp anneal_SiC
고출력∙고분해능 분말용 X-선 회절분석기High Resolution Powder-XRD
광학현미경-DiffusionOptical Microscopes-Diffusion
광학현미경-EBLOptical Microscopes-EBL
광학현미경-EtchOptical Microscopes - Etch
광학현미경-IOptical Microscopes - Photo
광학현미경-THinFilmOptical Microscopes - ThinFilm
구면수차보정 투과전자현미경HR FE-TEM-Ⅱ (2200FS with Image Cs Corrector)
구면수차보정 투과전자현미경HR FE-TEM-Ⅰ (2100F with Probe Cs-Corrector)
국소 레이져 전계형 원자단층현미경3D Atom Probe Tomography (LEAP4000X HR)
급속열산화막용 급속열처리기RTP for RTO
노광기-1I-Line Stepper - 1
노광기-2I-Line Stepper - 2
노광기-3I-Line Stepper - 3
노광기-4I-Line Stepper - 4
다결정규소막 식각장치Dry Etcher_Poly Si
마스크 정렬 노광 장비Mask Aligner_MA8
마스크리스 레이저 리소그래피 시스템Maskless laser lithography system
마스크얼라이너Mask Aligner_MA6
메탈 공정용 감광막 제거 장치PR Asher for BEOL
물리증착장치(스퍼터)- ISputter_ENDURA - 1
물리증착장치(스퍼터)- IISputter_ENDURA - 2
박막두께측정기Spectroscopic Ellipsometer
비접촉 3D 형상측정기3D Conforcal Scanning Microscope (3DCSM)
산화막 식각장치Dry Etcher_Oxide
선폭&표면 측정장치CD&Surface inspection system
세정 및 에칭장치Wet Station_Acid - 1
스트레스측정시스템Stress Measurement System
스핀건조기Spin Rinse Dryer
습식현상Wet Station_Organic
실리사이드용 급속열처리기RTP for Silicide
실리콘 고종횡비 식각장치 - 2Deep Reactive Ion Etcher(DRIE) - 2
알파스텝(ME)Alpha-Step (ME)
열처리 장비Furnace Metal Anneal
원자층증착장치Atomic Layer Deposition (ALD)
웨이퍼 마커Wafer Laser Marker
이온실리콘식각장치Deep Reactive Ion Etcher(DRIE) - 1
임계치수 측정 주사현미경CD-SEM
자외선 트렉 시스템PR Track_DAVID
저압 화학증착장치LP-CVD
전계 방출형 주사전자현미경[Hitachi S-4800] High Resolution FE-SEM- Ⅲ
전계 방출형 주사전자현미경[JSM 7800F PRIME with Dual EDS] High Resolution FE-SEM-Ⅱ
전계 방출형 주사전자현미경[JSM 7401F] High Resolution FE-SEM-I
전계방출전자현미경HR FE-SEM (in Clean Room)
전자빔 증착장비E-beam Evaporator-2
전자빔리소그래피시스템-1E-Beam Lithography System - 1
전자빔리소그래픽시스템-2E-Beam Lithography System - 2
전자빔증착기-1E-Beam Evaporator - 1
절연막건식 식각 장비Dry Etcher - TEL
초고진공화학기상증착기UHV-CVD
커브트레이서 및 프로브 스테이션Curve Tracer & Probe Station
트렉 시스템-IPR Track_TEL - 1
프로브스테이션_파워반도체(소자)Probe Station_Power Semiconductor
플라즈마 유도결합 식각장치Dry Etcher_DMS
플라즈마증착장치 - P5000PE-CVD - P5000
플라즈마증착장치-1PE-CVD-1
플라즈마증착장치-2PE-CVD-2
확산로 PartsWet Station_Acid - 2
AP-CVDAP-CVD
Atomic Force Microscope-Ⅰ(D 3100) / AFM-ⅠAtomic Force Microscope-Ⅰ(D 3100) / AFM-Ⅰ
Atomic Force Microscope-Ⅱ(Jupiter XR) / AFM - ⅡAtomic Force Microscope-Ⅱ(Jupiter XR) / AFM - Ⅱ
Cutting/Grinding/Polishing SystemCutting/Grinding/Polishing System
DC&RF 물리증착장비DC&RF Sputtering system
Dry-Etcher_gigalaneDry-Etcher_gigalane
Focused Ion Beam -Ⅰ(Helios 600 with TKD) / FIB -ⅠFocused Ion Beam -Ⅰ(Helios 600 with TKD) / FIB -Ⅰ
Focused Ion Beam -Ⅱ(Helios 650 with EBSD) / FIB -ⅡFocused Ion Beam -Ⅱ(Helios 650 with EBSD) / FIB -Ⅱ
Focused Ion Beam -Ⅲ(Helios G3 CX) / FIB -ⅢFocused Ion Beam -Ⅲ(Helios G3 CX) / FIB -Ⅲ
Focused Ion Beam -Ⅳ(SMI 3050) / FIB - ⅣFocused Ion Beam -Ⅳ(SMI 3050) / FIB - Ⅳ
Furnace_TEL - 1Furnace_TEL - 1
ICP 식각 장치 - 2Dry-Etcher_Ulvac
ICP 식각장치Dry Etcher_ICP
Ion Beam ThinnerIon Beam Thinner
LPCVD FurnaceLPCVD Furnace
Mask Aligner_MEMask Aligner_ME
Metal Lift-OffMetal Lift-Off
NEMS 제작을 위한 Base SystemNEMS White Wet station - Organic
NEMS 제작을 위한 Base SystemNEMS Yellow Wet station - Acid
NEMS 제작을 위한 Base SystemNEMS Yellow Wet station - Organic
NEMS 제작을 위한 Base SystemNEMS White Wet station - Acid
NEMS 제작을 위한 Base SystemNEMS Base System (optical microscope)
NEMS Spin CoaterNEMS Spin Coater
OLED 증착장비(200x200 glass)OLED Systems
PECVD System P-5000PECVD System P-5000
PZT 박막스퍼터링 시스템PZT sputtering
Raman Spectroscopy(Alpha 300 R)Raman Spectroscopy(Alpha 300 R)
Sputter (OLED)Sputter (OLED)
Surface Potential Measurement SystemSurface Potential Measurement System
Wet Station_Acid - 3Wet Station_Acid - 3
Wet Station_Pre CleanWet Station_Pre Clean
200 kV 전계방출형 투과전자현미경FE-TEM (200 kV)
200mm 다중 챔버 원자층 증착 시스템200mm Multi Chamber Atomic Layer Deposition System
2D Materials (가상)2D Materials (가상)
300mm 두께 측정 장비300mm Thickness Measurement System
300mm 매엽식 세정 장치300mm Single cleaner
300mm 웨이퍼 분류장치Wafer Sorter
300mm 웨이퍼 분류장치Wafer Sorter
300mm용 주사탐침현미경AFM (300mm Wafer)
300mmm 금속증착 장비Sputter
3차원 가상 공정 시뮬레이터Simulator3D
가변 레이저 시스템가변 레이저 시스템
감광제 제거 장비300mm PR Stripper
감광제 제거장치PR Stripper
감광제 제거장치PR Stripper
감광제 제거장치PR Stripper
건식 식각 장치Dry etch
겔투과 크로마토그래피GPC
고면저항 측정기(CMOS) 4-Point Probe
고밀도 플라즈마 화학기상 증착 장비300mm HDPCVD
고밀도 플라즈마 화학기상증착장치HDPCVD
고분해능 전계방사형 주사전자현미경Inline FE-SEM
고분해능 전계방출형 주사전자현미경UHR FE-SEM
고성능 유세포 측정분석기High Performance Flow Cytometer
고속 회전 절삭기Dicing machine
고속 회전 절삭기Dicing Sawing Maching & spin dryer
고속원심분리기Centrifuge
고에너지 이온주입장치High energy implant
고온 열처리 확산로Furnace (High Temp Ox)
고전류 이온주입장치High current Ion Implanter
고종횡비 산화막 건식식각장치HAR Dielectric Etcher
고종횡비 실리콘 식각 장비Deep Si Etcher
고진공 웨이퍼 본딩장치High vacuum wafer bonding system
고진공 패키징 장치High Vacuum Sealing system
공초점 레이저 주사 현미경Confocal Laser Scanning Microscope
구리용 스퍼터CMOS Sputter - Ti/TiN/Co/Al
구면수차보정 주사투과전자현미경Cs-corrected STEM
극자외선축소투영노광시스템KrF Inline Scanner
극자외선축소투영노광시스템KrF inline Scanner
근적외석 카메라Photonics SWIR Camera
글러브박스Glove Box
금속 식각 장비Metal Etching System
금속 식각장치Metal Etcher - Al,Ti,TiN
급속 열처리장치Spike RTP system
급속 열처리장치RTP system
급속 열처리장치RTP system
급속 열처리장치RTP system (Metal grade RTP)
나노구조 캐스팅 장치nanostructure casting
나노압입시험기Nanoindentation Tester
나노압입시험기Nanoindentation Tester
나노폴리머 기상증착기i-CVD
나노폴리머 캐스팅 장비Nano Polymer Casting Machine
다기능 엑스선 광전자 분광기Multi-Functional XPS
다중물리센서 설계 소프트웨어MEMS Process Design Kit (Coventorware)
다중타겟 스퍼터Multi-Sputter
다중타겟 스퍼터Multi-target sputter
다중타겟 스퍼터NEMS - Multi Target Sputter
단광자 검출기Superconducting Nanowire Single Photon Detector
대기압 플라즈마처리Plasma Treatmet System
듀얼집속이온빔장치DB-FIB
듀얼집속이온빔장치8-inch DB-FIB (EDS)
듀얼집속이온빔장치DB-FIB
라만 분광기Raman Spectrometer
레이저 마이크로 시스템Laser Micromachining System
레이저 마킹장치Laser Source Marking
레이저 어닐장치Laser Anneal system
마스크 세정장치Mask Cleaner
마스크 제작기Mask Generator
마스크리스 얼라이너Maskless Aligner
마이크로 전극성형기Micro electrode patterning system
마이크로 클리빙 장치Micro Cleaving System
마이크로 패터닝 시스템Micro patterning system
만능재료 시험기Universal Testing Machine
매뉴얼 프로브 스테이션Manual Probe Station
멀티챔버 식각장치Metal Etcher - Al,Ti,TiN,W
멤스용 감광제 제거장치PR Stripper - NEMS 전용
멤스용 세정장치Wet Station - NEMS Acid
멤스용 세정장치Wet Station - NEMS Solvent
멤스용 열처리 확산로NEMS - Furnace
멤스용 열처리 확산로MEMS Furnace
멤스용 저압화학기상 증착로Poly Furnace
멤스용 저온 열처리로NEMS - Low Temp Anneal Furnace
멤스용 화학기상 증착장치MEMS PETOS
멤스용 화학기상 증착장치Multiple PECVD
면저항 측정기(Sensor) 4-point Probe
면저항 측정기(NEMS) 4-point Probe
미세유체 특성평가 시스템Microfluidic performance analyzer
바이오 스핀 코터BiO Spin Coater
반도체 기판의 휨 측정 장비Wafer Warpage Measuring System
반자동 진공 프로브스테이션Semi-auto Vacuum Probe Station
복합환경시험기Complex Environment Tester
분광 반사 및 타원해석기Auto Thickness Measurement System
분광 반사율 측정기Reflectormeter (Litho)
분광 반사율 측정기Reflectormeter (NEMS)
분광반사율측정기Spectroscopic Reflectometer
분광타원편광해석기Spectroscopic Ellipsometer
불화아르곤 노광기ArF dry scanner
비파괴 선폭측정 주사현미경CD-SEM
비파괴 선폭측정 주사현미경CD SEM
비표면적 측정장치BET(surface area analyzer)
비표면적분석기BET(surface area analyzer)
비행시간형 이차이온질량분석기Time-of-Flight SIMS
산화물 식각장치Dielectric Etcher - BEOL
산화물 식각장치Dielectirc / Poly Etcher
세미오토 프로브 스테이션Semi-auto Probe Station
세정장비Wet Station
센서 특성 평가 수동 시스템Vacuum Probe Station
수동 감광제 도포 및 가열장치Manual Coater
수동 세정장치MEMS Wet Station - Develop
수동 세정장치MEMS Wet Station - Develop
수직형 열처리 확산로Furnace (Vertical Gate)
스탭식투영노광장치I-line Stepper
스탭식투영노광장치I-line Stepper
스텔스 레이져 다이싱 장치Stealth Laser Dicer
신소재 세정장치신소재 Wet Station
실리콘 건식식각장치Si Micro-machinable etcher
실시간 유전자 증폭기Real time PCR
싱글집속이온빔장치SB-FIB
압전물질 건식 식각압전물질 건식 식각
압전박막 결정성장 증착장비AlN sputter
액침 불화아르곤 엑시머 레이저 노광기ArF Immersion Scanner
엑스선 광전자 분광기X-ray Photoelectron Spectroscopy
엑스선 회절분석기X-Ray Diffractometer
엘라이저 리더Spectrophotometer
연삭용 필름 라미네이션 장치Tape Laminater
연삭용 필름 제거 장치Tape Remover
연속증착식각장치Continuous deposition & etching equipment
열 산화막 성장로Thermal Oxidation Furnace
열중량/시차주사열량 동시 열분석기TGA DSC
열처리 확산로Furnace (Gate Ox)
열처리 확산로Furnace (Any Ox)
열처리 확산로Furnace (Metal Ox)
오토스테이지 광학현미경Auto-stage Microscope
온도사이클시험기NEMS Temperature Cycle
와이어 본딩 시스템Wire Bonding System
원자 탐침 단층현미경Atom Probe Tomography
원자층 이온빔 식각장치Atom Layer Ion Beam Delayer(ALIBD)
웨이퍼 레벨 3차원 비파괴 검사시스템WL 3D SAM
웨이퍼 면취 장치Edge Grinder
웨이퍼 본더Multi stack wafer bonder
웨이퍼 세정 장비Wet Station - Post Cleaner
웨이퍼 세정 장비Non_Metal
웨이퍼 세정 장비Metal_Acid
웨이퍼 세정 장비Metal_Solvent
웨이퍼 연삭 및 연마 장치Back Grinder
웨이퍼 절단 장치Dicing Saw
이온반응식각장치RIE
이온반응식각장치Reactive Ion Etcher
이온연마장치TEM - Sample Preparation
임계점 건조장치(불용, 폐기예정)Critical Point Dryer
임계치수 전자주사현미경CD SEM
임프린트 시스템Nano Imprint Lithography System
입도 분석기Particle Size Analyzer
자기섹터 이차 이온 질량분석기Magnetic Sector SIMS
자동 감광제 도포장치MEMS Track for Aligner
자동 감광제 도포장치I-line Track
자동 감광제 도포장치Auto Track for Aligner
자동 감광제 도포장치I-line Track
자동 리프트오프 장비Auto Lift-off M/C
자동 양면 마스크 얼라이너 장비Automated Doubleside Contact Aligner
자동 웨이퍼 본딩장치Wafer Bonder
자동 프로브 스테이션Auto Probe Station
자동 화학기상 증착장치PECVD(Auto)
자동감광제 도포장치(ArF용)Track(Spinner) for ArF Immersion Scanner
자동핵산 추출기Nucleic Acid Extractor
잔류응력 측정기Stress Gauge
저압 화학기상 증착로Furnace(LPCVD Nitride)
저압 화학기상 증착로Furnace (LPCVD Poly)
저압 화학기상 증착로Furnace (LPCVD TEOS)
저압 화학기상 증착로Furnace (LPCVD Nitride)
저압 화학기상 증착로LPCVD Nitride Furnace
저온 열처리 확산로Furnace (Low Temp Anneal)
저온 이온빔 단면가공기Cross Section Polisher
저응력 질화막 증착로Low Stress Nitride Furnace
저응력 질화막 증착로Low Stress Nitride Furnace
적외선 분광기FT-IR Microscope
전계방출형 주사전자현미경FE-SEM (EDS)
전계방출형 주사전자현미경FE-SEM (S4800-1)
전계방출형 투과전자현미경FE-TEM (300 kV)
전자빔증착장치NEMS - E-Beam Evaporator
전자빔증착장치NEMS - E-Beam Evaporator
전자선 리소그라피시스템E-beam System (JEOL)
전자선용 감광제 도포장치E-beam Track
접착 및 압인 가공장치Fusion bonder / Hot embossing
접촉식 단차측정기Surface Profiler
접촉식 마스크 노광기Contact Aligner
접촉식 마스크 노광기Contact Aligner
주사탐침현미경AFM (SPM-PSIA)
중전류 이온주입 장치Medium current Ion Implanter
진공 퍼니스Vacuum Furnace
진공오븐Vacuum Oven
진공포장기Vacuum Packaging
진공포장기Vacuum Packaging
체외진단용 유전자 증폭기Real Time PCR
초가속 온습도 스트레스 시험기NEMS HigH Accelerate
초음파 발생기Ultrasonic generator
초음파 융착기Sonic Bonder
충방전 테스트 시스템Charge / Discharge test system
층간중첩도 측정장치Overlay
층간패턴 중첩도 측정장치Overlay measurement
층간패턴 중첩도 측정장치Overlay Measurement
컵타입 전해도금장치NEMS - Electroplating
컵타입 전해도금장치NEMS - Electroplater
텅스텐 화학기상 증착장치CVD W
티타늄 물리기상 증착장치CMOS Sputter - Ti/TiN/Co/Al
파티클오염 검수장치Particle Counter
패키지 실장 평가 시스템Reflow
패턴 웨이퍼 결함 검사 장비Defect Inspection
펨토초 유연소재 가공장치Multi-function fs laser systems
편광 현미경Polarizing microscope
포토마스크 제작장치(가상코드)Photo Mask Fabrication
폴리머 도포장치Parylene Coater
폴리머 몰딩 장치polymer molding
폴리머 식각장치Polymer Etcher
폴리메탈 식각장치Poly / Metal Etcher + PR Strip
폴리실리콘 증착로Furnace (LPCVD Poly)
표면 플라즈마 공명기Surface Plasmon Resonance
표면단차측정기Surface Profiler (Etch)
표면탄성파 발생기Surface Acoustic Wave SAW Generator
플라즈마 화학기상 증착 장비300mm PECVD
플로팅 커팅기Plotting Cutting
플립 칩 본더Flip chip bonder
필름 라미네이터Film Laminating
필름 제거 세정 장치Film Strip Wet Station
화학 센서 평가 시스템Sensing Performance Measurement System
화학기상 증착로Furnace (LPCVD TEOS)
화학기상 증착장치a-Si/Oxide/Nitride
화학기상 증착장치SiH4 Base PECVD/HDP
화학기상 증착장치PETEOS/BPSG
화학물리적 구리박막 연마장치CMP System
화학물리적 산화막 연마장치W CMP
화학물리적 산화막 연마장치Oxide CMP
후면광자검출기Inverted Photon Emission Microscope
Auto. double side mask alignmentAuto. double side mask alignment
BiO Wet Station Bio-SEMBio-SEM
CVD WCVD W
DAL10 Desktop SEMDesktop SEM
EME40metal etch
EPO10poly etch
FE-SEM(S4800-2)FE-SEM(S4800-2)
FOUP 세정장치FOUP Cleaner
ion Beam Evaporatorion Beam Evaporator
LDI20particle counter
Linux server (dotori)NN+A236+D236
LMS10광학현미경
Low Temp. PECVDLow Temp. PECVD
LTK10Track System
LTK20TEL ACT-8 Track System
LTK50ArF DRY용 Track
LTK60S204B용 track
Material AnalysisMaterial Analysis
MSI30M-SIMS(A)
NEV50ion beam evaporator
NIM10ICP-MS
NUV10UV Curing
NWS50Wet cleaning
OPCOPC
PECVDPECVD
Spray coaterSpray coater
Wet cleaningWet cleaning
3차원 공정시스템3D fabrication system
검사용 마이크로스코프Inspection microscope(manual)
검사용 마이크로스코프Inspection microscope(semi-auto)
고성능 산화막식각장비Deep oxide/SiC etching system
고성능 절연막 식각기Dielectric ICP Etcher System
금속 습식식각장비Metal wet etch station
금속박막식각시스템Metal etcher system
금속박막증착시스템Metal sputtering system
금속습식세정장비Metal Wet Station
급속열처리시스템RTP(Rapid Thermal Process) System
급속열처리장비Rapid Thermal Processor
기상 자기조립박막 증착시스템Vapor Self-Assembled Monolayer deposition system
기판 절단 시스템Substrate dicing saw system
기판그라인딩시스템Substrate grinding system
기판두께측정장비Substrate measurement system
기판접합용 정렬기Substrate bond aligner
기판폴리싱시스템Substrate polishing system
나노임프린팅 시스템Nano-imprinting lithography system
다기능 전자빔 진공증착 시스템Multi-functional electron beam evaporation system
다기능직류형이온밀링시스템다기능직류형이온밀링시스템
단차측정기Surface profiling measuring system
레이저 라이터Laser writer
레이저마킹시스템substrate Marking system
마스크 매엽식 세정장치Mask Single Wet Tool
박막두께측정기Reflectometer
박막스트레스측정시스템Film stress measurement system
박막증착시스템Plasma-enhanced chemical vapor deposition system
배선공정용 화학기상증착장비배선공정용 화학기상증착장비
비접촉 미세형상 측정기Optical surface profiler
비정질실리콘증착장비a-Si PECVD
소자측정분석시스템Semi Auto probe Station System
수직 열처리 시스템Vertical Annealing Furnace
수평 열처리 시스템Horizontal Annealing Furnace
스핀코팅기spin coater(6inch)
스핀코팅기spin coater(pieces)
스핀코팅기manual spin coater_4inch
스핀코팅기(포토레지스트 트랙시스템)PR track system
실리콘 고준위 식각기Silicon Deep Reactive Ion Etcher
실리콘 습식식각장비Si wet etch station
씨모스전용 저압기상증착장비씨모스전용 저압기상증착장비
엘립소메타 시스템Ellipsometer system
열 원자층 증착 시스템thermal atomic layer depositon system
열확산로시스템Diffusion furnace
웨이퍼 건조기Spin Rince Dryer
웨이퍼 건조기Spin Rince Dryer
웨이퍼식각기(Cleaning)cleaning wet station
웨이퍼식각기(Etching)etch wet station
자동마스크정렬기Automatic mask aligner
저온플라즈마증착시스템저온플라즈마증착시스템
저진공 전자현미경Low Vacuum Microscope
전기도금장비Electroplating machine
전자빔리소그래피 시스템Electron beam lithography system
전자빔묘화공정시스템전자빔묘화공정시스템
전자빔진공증착기E-beam Evaporation system
절연막 스퍼터링 시스템Dielectric sputtering system
절연막 식각기Dielectric Etcher system
접촉각 측정 시스템Contact angle measurement system
제논 릴리즈 식각시스템Xenon Release etcher system
중전류형 이온주입장비Medium current ion implanter
진공건조기Vacuum Oven
질화알루미늄 스퍼터링 시스템AlN Sputtering System
초음파탐상이미징장비Scanning Acoustic Microscope
축소미세노광장비I-line stepper
클러스터 건식 식각기Cluster Dry etcher
패럴린 코팅 시스템Parylene coating system
패턴 임계치수측정 주사전자현미경패턴 임계치수측정 주사전자현미경
포클열확산로 시스템POCl3 diffusion furnace system
포토레지스트트랙시스템Photoresist Track System
포토습식세정장비Photo Wet Station
폴리실리콘화학기상증착장비(Doped) Poly-Si LPCVD
표면저항측정시스템Sheet Resistance Measurement System
플라즈마 원자층 증착 시스템Plasma Atomic Layer Deposition System
플라즈마증착시스템Plasma deposition system
화학기계연마시스템화학기계연마시스템
화학기상증착시스템LPCVD system
화합물반도체 식각장비Compound semiconductor etching system
I-line축소노광기I-line stepper
Power Supply by 2 Items(김수환)
Logic Analyzer(전동석)
Power Supply by 3 Items
Data Generator
Logic Analyzer(16903A)
DC Power Supply
DC Electronic Load
Digital Hot Plates
Multi-Tools
Source Meter Dual Channel
DC Power Supply(2220G-30-1)
DC Power Supply(2230G-60-3)
Universal Frequency Counter / Timer
Femto/Pico Ammeter
Multimeter
Mixed Signal Oscilloscope(전동석)
Power Supply by 2 Items
DC Power Analyzer
Lightwave Measurement System
LAN/GPIB gateway
ENA Network Analyzers
Wide-Bandwidth Oscilloscopes
Waveform Generator
AC Power Supply
Stereo Microscope
Oscilloscope
Logic Analyzer(김수환)
Mixed Signal Oscilloscope(최우석)
Digital Phosphor Oscilloscope
Programmable Power Supply(1호기)
Digital Phosphor Oscilloscope Datasheet(1호기)
Logic Analyzer(TLA714)
Waveform Generator Dual Channel
Power Supply by 2 Items(전동석)
Programmable Power Supply(2호기)
Digital Phosphor Oscilloscope Datasheet(2호기)
Programmable Power Supply(3호기)
오실로스코프 (03)
Power Source
Pulse Generator
RIE Etcher(화합물,08)RIE Etcher (02) (화합물)
2D 표면 단차 측정기 (01)C-Surface Profiler
2D 표면 단차 측정기 (02)2D Surface Profiler (02)
2D 표면 단차 측정기 (03)Surface Profiler
2D 표면 단차 측정기 (2)C-Surface Profiler (02)
3D 표면 단차 측정기 (02)3D Surface Profiler (02)
4-포인트 프로브 (02)4-Point Probe (01)
4-포인트 프로브 (03)C-4-Point Probe (01)
광학 현미경 (01)Optical Microscope (01)
광학 현미경 (02)Optical Microscope (02)
광학 현미경 (03)Optical Microscope (03)
광학 현미경 (04)Optical Microscope (04)
광학 현미경 (05)Optical Microscope (05)
광학 현미경 (06)Optical Microscope (06)
금속 산화물 스퍼터 (01) SNTEKMetal-Oxide Sputter (01)
금속 산화물 스퍼터 (02) SRN sputter 2Metal-Oxide Sputter (02)
금속 스퍼터 (01)Metal Sputter (03)
금속 스퍼터 (01)Metal Sputter (01)
금속 스퍼터 (02)Metal Sputter (02)
금속 스퍼터 (04)Metal Sputter (04)
깊이 측정 현미경Depth Measurement Microscope
네트워크분석기 (01)네트워크 분석기
담당자 호출담당자 호출
레이져 홀로그래피 시스템Laser Holography System
리플렉토미터(Nanospec)Reflectometer (02)
리플렉토미터(Nanospec)Reflectometer (01)
리플렉토미터(Nanospec) (01)C-Reflectometer
마스크리스 리소그래피 시스템 (01)Maskless lithography system (01)
마스크리스 리소그래피 시스템 (02)Maskless lithography system (02)
면저항 측정기4-Point Probe (02)
면저항 측정기C-4-Point Probe (02)
면저항 측정기4-Point Probe (03)
반도체 소자 특성 측정기 (01)SPA-IV (01)
반도체 소자 특성 측정기 (02)SPA-IV (02)
반도체 소자 특성 측정기 (03)SPA-IV (03)
반도체 소자 특성 측정기 (04)SPA-IV/CV (01)
반도체 소자 특성 측정기 (05)SPA-IV/CV (02)
비트에러율테스터 (01)고성능비트에러율테스터 (01)
비트에러율테스터 (02)고성능비트에러율테스터 (02)
비트에러율테스터 (03)고성능비트에러율테스터 (03)
슈퍼 잉크젯 프린터Super Inkjet Printer
스트레스 측정기Stress Measurement
스펙트럼 분석기 (01)스펙트럼 분석기 (01)
스펙트럼 분석기 (02)스펙트럼 분석기 (02)
스피너 (03)Spin Coater (05) (E-BEAM)
스핀 코터 (01)Spin Coater (01)
스핀 코터 (02)Spin Coater (04)
스핀 코터 (05)Spin Coater (02)
스핀 코터 (06)Spin Coater (03)
스핀 코터 (06)Spin Coater (06)
씨모스 금속 스퍼터 (01) Endura 2C-Metal Sputter (01)
씨모스 원자층 증착 장비 (01)C-ALD (01)
씨모스 원자층 증착 장비 (02)C-ALD (02)
씨모스 원자층 증착 장비 (03)C-ALD (03)
씨모스 원자층 증착 장비 (04)C-ALD (04)
얼라이너 (01)Aligner (01)
얼라이너 (02)Aligner (02)
에너지 분산 X선 분광기EDS
엘립소미터 (01)C-Ellipsometer (01)
엘립소미터 (02)C-Ellipsometer (02)
엘립소미터 (03)Ellipsometer
열 금속 증착 장비 (01)Thermal Evaporator
오실로스코프 (01)오실로스코프 (01)
오실로스코프 (02)오실로스코프 (02)
와이어 볼 본딩 장비Wire Ball Bonder
원자 힘 현미경 (01)AFM (01)
원자 힘 현미경 (02)AFM (02)
원자층 증착 장비 (04)ALD (04)
원자층 증착 장비 (01)ALD (01)
원자층 증착 장비 (02)ALD (02)
원자층 증착 장비 (03)ALD (03)
웨이퍼 마커Wafer Marker
웨이퍼 절삭기 (02)Dicing Saw (02)
웨이퍼 절삭기 (03)Dicing Saw (03)
유도 결합 플라즈마 식각 장비 (01)C-ICP Poly Si Etcher (01)
유도 결합 플라즈마 식각 장비 (02)C-ICP Poly Si Etcher (02)
유도 결합 플라즈마 식각 장비 (03)C-ICP Metal Etcher
유도 결합 플라즈마 식각 장비 (04)C-ICP Dielectric Etcher
유도 결합 플라즈마 식각 장비 (05)Deep Si Etcher (01)
유도 결합 플라즈마 식각 장비 (06)ICP HT Metal Etcher (02)
유도 결합 플라즈마 식각 장비 (08)ICP Dielectric Etcher (01)
유도 결합 플라즈마 식각 장비 (13)Deep Si Etcher (02)
임계치수 측정 주사전자현미경C-CD-SEM
전계 방출형 주사전자현미경 (01)FE-SEM (01)
전계 방출형 주사전자현미경 (02)FE-SEM (02)
전자빔 금속 증착 장비 (01)E-Gun Evaporator (01)
전자빔 금속 증착 장비 (02)E-Gun Evaporator (02)
전자빔 리소그래피E-Beam Lithography
중전류 이온주입 장비Ion Implanter
파장 분산 엑스선 형광 분석기WD-XRF
패럴린 막 증착 장비Parylene Deposition System
퍼니스 (01)C-Furnace (01)
퍼니스 (02)C-Furnace (02)
포토 레지스트 8종Photo Resist_8 Type
플라즈마 화학기상증착기 및 자기 강화 반응성 이온 식각기 (01)PECVD/RIE System
홀 효과 측정기Hall Effect Measurement
화학적 건식 식각 장비C-Chemical Dry Etcher
Acid-Solvent-Wet Station (21)Wet Station (21) (Acid-Solvent)
Acid-Wet Station (01)Wet Station (01) (Acid)
Acid-Wet Station (02)Wet Station (02) (Acid)
Acid-Wet Station (03)Wet Station (03) (Acid)
Acid-Wet Station (04)Wet Station (04) (Acid)
Acid-Wet Station (12)Wet Station (12) (Acid)
Acid-Wet Station (13)Wet Station (13) (Acid)
Acid-Wet Station (14)Wet Station (14) (Acid)
Acid-Wet Station (15)Wet Station (15) (Acid)
Acid-Wet Station (16)Wet Station (16) (Acid)
Acid-Wet Station (17)Wet Station (17) (Acid)
Acid-Wet Station (WA-5)Wet Station (05) (Acid)
ARBITRARY WAVEFROM GENERATOR (01)Arbitrary Wavefrom Generator
BMR ICP Etcher (07)ICP Compound Etcher
C-Furnace (03)C-Furnace (03)
CMP (02)C-CMP (02)
HDPCVD 1호기(SiO2)C-HDPCVD (01)
HDPCVD 2호기(SiO2)C-HDPCVD (02)
HW-CVD [α-Si, SiN]HWCVD
ICP Dielectric Etcher (02)ICP Dielectric Etcher (02)
ICP Metal Etcher (01)ICP Metal Etcher (01)
ICP Metal Etcher (03)ICP Metal Etcher (03)
i-line 스테퍼C-i-line Stepper
In-Line 임계치수 측정 주사전자현미경CD-SEM
LOGIC ANALYZER (01)LOGIC ANALYZER (01)
LOGIC ANALYZER (02)LOGIC ANALYZER (02)
LPCVD 1호기 [α-Si, MTO, SiN]]C-LPCVD (01)
LPCVD 3호기 [Poly-si, SiN]C-LPCVD (03)
LPCVD(리드)C-LPCVD (04)
MEMS FurnaceFurnace
Mini FurnaceMini Furnace
OXFORD PECVD [SiO2, Si3N4]PECVD
P5000 4호기 [TEOS-CVD, W-CVD, SiO/SiN ETCH]C-PECVD/RIE System
P5000 5호기 [W]C-CVD(W) System
PR 건식 애셔 (01)C-Asher
PR 건식 애셔 (02)Asher (03)
PR 트랙 장비 (01)C-Track
PR 트랙 장비 (02)Track
PR 플라즈마 애셔 (1)Asher (01)
PR 플라즈마 애셔 (2)Asher (02)
PULSE GENERATOR (01)Pulse Generator
RIE Etcher (신소재,09)RIE Etcher (01) (신소재)
RTA (04)RTA (04)
RTA (급속열처리장치_CMOS RTA)C-RTA
RTA (급속열처리장치_non CMOS)RTA (02)
RTP (급속열처리장치_전기로)C-RTP
Solvent-Wet Staion (06)Wet Station (06) (Solvent)
Solvent-Wet Staion (08)Wet Station (08) (Solvent)
Solvent-Wet Staion (09)Wet Station (09) (Solvent)
Solvent-Wet Staion (10)Wet Station (10) (Solvent)
Solvent-Wet Staion (18)Wet Station (18) (Solvent)
Solvent-Wet Staion (20)Wet Station (20) (Solvent)
Solvent-Wet Staion (24)Wet Station (24) (Solvent)
Spin Rinse Dryer (1)Spin Rinse Dryer (01)
Spin Rinse Dryer (10)Spin Rinse Dryer (10)
Spin Rinse Dryer (11)Spin Rinse Dryer (11)
Spin Rinse Dryer (2)Spin Rinse Dryer (02)
Spin Rinse Dryer (3)Spin Rinse Dryer (03)
Spin Rinse Dryer (4)Spin Rinse Dryer (04)
Spin Rinse Dryer (5)Spin Rinse Dryer (05)
Spin Rinse Dryer (6)Spin Rinse Dryer (06)
Spin Rinse Dryer (7)Spin Rinse Dryer (07)
Spin Rinse Dryer (8)Spin Rinse Dryer (08)
Spin Rinse Dryer (9)Spin Rinse Dryer (09)
STI CMP (01)C-CMP (01)
VECTOR SIGNAL GENERATOR (01)Vector Signal Generator
110GHz modeling sys.110GHz modeling sys.
3D Laser Profiler3D Laser Profiler
4 point probe4 point probe
67GHz modeling sys.67GHz modeling sys.
8 inch Wafer Automatic Sheet Resistance Measurement System8 inch Wafer Automatic Sheet Resistance Measurement System
리프트오프용 이빔증착기리프트오프용 이빔증착기
Acid / Organic wet stationAcid / Organic wet station
Acid Wet-Bench(R&D)Acid Wet-Bench(R&D)
Acid Wet-station(산업화)Acid Wet-station(산업화)
Acid Wet-station(R&D)Acid Wet-station(R&D)
AFM I -> FC-AM30으로 변경AFM I -> FC-AM30으로 변경
AFM I, II (model: XE100, Park systems)AFM I, II (model: XE100, Park systems)
AFM I, II (model: XE100, Park systems)AFM I, II (model: XE100, Park systems)
AFM III (model: XE150, 6인치 가능)AFM III (model: XE150, 6인치 가능)
Alkali Wet-Bench(R&D)Alkali Wet-Bench(R&D)
Alkali Wet-station(foundry)Alkali Wet-station(foundry)
Alkali Wet-station(R&D)Alkali Wet-station(R&D)
Analytic STEMAnalytic STEM
Asher(DAS2000)Asher(DAS2000)
Atomic Layer Deposition - InsulatorsAtomic Layer Deposition - Insulators
Atomic Layer Deposition - MetalsAtomic Layer Deposition - Metals
Au Plating Machine II (backside)Au Plating Machine II (backside)
Auto Precision Grinding and Polishing SystemAuto Precision Grinding and Polishing System
Auto Wet StationAuto Wet Station
Automated Mask Aligner IAutomated Mask Aligner I
Automated Mask Aligner IIAutomated Mask Aligner II
Automated Mask Aligner IV (8 inch)Automated Mask Aligner IV (8 inch)
Automatic ElipsometerAutomatic Elipsometer
Box FurnaceBox Furnace
BreakerBreaker
CD SEMCD-SEM I (9260)
CD-SEM II (8820)CD-SEM II (8820)
CL(Cathodoluminescence) SystemCL(Cathodoluminescence) System
CL(Cathodoluminescence) System -> FC-CL10으로 변경CL(Cathodoluminescence) System -> FC-CL10으로 변경
Contact Aligner I (Manual)Contact Aligner I (Manual)
Contact Aligner II (Manual)Contact Aligner II (Manual)
Contact Aligner VIIIContact Aligner VIII
Convection oven IConvection oven I
Convection oven IIConvection oven II
Cu & Ni Plating Machine (R&D)Cu & Ni Plating Machine (R&D)
Cu CMPCu CMP
Cu Plating Machine for DamasceneCu Plating Machine for Damascene
DC measurement system for high power devicesDC measurement system for high power devices
Deep etcher VI(R&D)Deep etcher VI(R&D)
Defect-Review SEMDefect-Review SEM
Develop Wet-Bench(Litho)Develop Wet-Bench(Litho)
Dicing Machine IDicing Machine I
Dicing Machine IIDicing Machine II
Dicing Machine IIIDicing Machine III
Dicing Machine IVDicing Machine IV
Die-bonder (Back-end)Die-bonder (Back-end)
Doping profiler(ECV) -> FE-DP10 변경Doping profiler(ECV) -> FE-DP10 변경
E-beam curing machineE-beam curing machine
E-beam evaporator (산업화) IE-beam evaporator (산업화) I
E-beam evaporator (산업화) IIE-beam evaporator (산업화) II
E-beam evaporator (R&D) IE-beam evaporator (R&D) I
E-beam evaporator (R&D) IIIE-beam evaporator (R&D) III
E-beam evaporator II (R&D)E-beam evaporator II (R&D)
E-beam lithography I (9300)E-beam lithography I (9300)
E-beam lithography II (6000)E-beam lithography II (6000)
Electrochemical CV ProfilerElectrochemical CV Profiler
Endura sputterEndura sputter
Evatec sputterEvatec sputter
FE SEM IFE SEM I
FE SEM IIFE SEM II
FE SEM II -> FC-SM20으로 변경FE SEM II -> FC-SM20으로 변경
FE SEM IIIFE SEM III
FE SEM IVFE SEM IV
FIB Ⅲ (model : Helios 5 UX, Thermofisher)FIB Ⅲ (model : Helios 5 UX, Thermofisher)
FIB I (model: Nova 600, FEI사)FIB I (model: Nova 600, FEI사)
FIB II (model: Quanta 3D FEG, FEI)FIB II (model: Quanta 3D FEG, FEI)
FIB->FC-FI10으로 변경FIB->FC-FI10으로 변경
FTIRFTIR
FurnaceFurnace
Hall effect Measurement SystemHall effect Measurement System
Hall Measurement System -> FE-HA10 변경Hall Measurement System -> FE-HA10 변경
HDP-CVDHDP-CVD
HDP-CVD (R&D)HDP-CVD (R&D)
Horizontal Grinding M/CHorizontal Grinding M/C
Hot Plate Baker IHot Plate Baker I
Hot Plate Baker IIHot Plate Baker II
HR-TEM IIHR-TEM II
ICP etcher (산업화) IICP etcher (산업화) I
ICP etcher (산업화) IIICP etcher (산업화) II
ICP etcher (산업화) IIIICP etcher (산업화) III
ICP etcher I(R&D)ICP etcher I(R&D)
ICP etcher II(R&D)ICP etcher II(R&D)
ICP etcher III(R&D)ICP etcher III(R&D)
ICP etcher IV(R&D)_DRIEICP etcher IV(R&D)_DRIE
ICP PR asher I(foundry)ICP PR asher I(foundry)
ICP PR asher II(foundry)ICP PR asher II(foundry)
ICP PR asher(R&D)ICP PR asher(R&D)
ICP PR asher(R&D)ICP PR asher(R&D)
I-line Stepper II(양자팹)I-line Stepper II
Insulator / Si EtcherInsulator / Si Etcher
Ion CoaterIon Coater
KrF StepperKrF Stepper
Laminating MachineLaminating Machine
Lapping and Polishing M/CLapping and Polishing M/C
Laser Lift-offLaser Lift-off
Laser ScriberLaser Scriber
Liftoff MachineLiftoff Machine
Lift-Off Wet-Bench(R&D)Lift-Off Wet-Bench(R&D)
LIV SystemLIV System
l-line Stepperl-line Stepper
Mask CleanerMask Cleaner
MBE (As)MBE (As)
MBE (N)MBE (N)
Metal EtcherMetal Etcher
Microscope IIMicroscope II
Microscope IVMicroscope IV
Microscope VI (Auto-Loader)Microscope VI (Auto-Loader)
Microwave Asher (Dual)Microwave Asher (Dual)
Microwave asher (foundry): DualMicrowave asher (foundry): Dual
Microwave asher (foundry): DualMicrowave asher (foundry): Dual
Mini FurnaceMini Furnace
MOCVD (epi) IMOCVD (epi) I
MOCVD (epi) IIMOCVD (epi) II
MOCVD -> FE-MC10 변경MOCVD -> FE-MC10 변경
MOCVD(epi) ⅥMOCVD(epi) Ⅵ
MOCVD(epi) IIIMOCVD(epi) III
MOCVD(epi) IVMOCVD(epi) IV
MOCVD(epi) VMOCVD(epi) V
MOCVD(epi) VIIMOCVD(epi) VII
MultiPrepMultiPrep
Nano ImprintNano Imprint
Non-contact sheet resistanceNon-contact sheet resistance
Non-contact sheet resistance -> FE-SR10 변경Non-contact sheet resistance -> FE-SR10 변경
Optical Thickness Measure SystemOptical Thickness Measure System
Organic Wet-Bench(Litho)Organic Wet-Bench(Litho)
Organic Wet-Bench(R&D)Organic Wet-Bench(R&D)
Organic Wet-station(foundry)Organic Wet-station(foundry)
Organic Wet-station(Litho)Organic Wet-station(Litho)
Organic Wet-station(R&D)Organic Wet-station(R&D)
Overlay Metrology SystemOverlay Metrology System
Parameter analyzer I (FC-PS30통합)Parameter analyzer I (FC-PS30통합)
Parameter analyzer II (FC-PS30으로통합)Parameter analyzer II (FC-PS30으로통합)
Pattern Design ToolPattern Design Tool
PECVD (산업화) IIPECVD (산업화) II
PECVD (산업화) III_P5000PECVD (산업화) III_P5000
PECVD IPECVD I
PhotoluminescencePhotoluminescence
PIPS IPIPS I
PIPS IIPIPS II
PL mapper -> FE-PL10 변경PL mapper -> FE-PL10 변경
Probe station I (FC-MO20으로통합)Probe station I (FC-MO20으로통합)
Probe station II (FC-MO10으로통합)Probe station II (FC-MO10으로통합)
Probe station III (DC)Probe station III (DC)
ProberProber
Rapid Thermal Process SystemRapid Thermal Process System
RF Noise Parameter MeasurementRF Noise Parameter Measurement
RF Power Measurement SystemRF Power Measurement System
RIE (산업화)RIE (산업화)
RIE II (산업화)_P5000RIE II (산업화)_P5000
RTA (R&D)RTA (R&D)
RTA IIRTA II
Scanning PLScanning PL
Scribing and Breaking M/CScribing and Breaking M/C
SiC EtcherSiC Etcher
Solar simulatorSolar simulator
SpectrophotometerSpectrophotometer
Spin Coater llSpin Coater ll
Spin EtcherSpin Etcher
SPM Wet-station(R&D)SPM Wet-station(R&D)
Spray DeveloperSpray Developer
Sputter (R&D I)Sputter (R&D I)
Sputter System (Batch)Sputter System (Batch)
Sputter System (Cluster)Sputter System (Cluster)
Sputter(E5500)Sputter(E5500)
Stress Measurement SystemStress Measurement System
Surface Scan/ProfilerSurface Scan/Profiler
Temperature and Humidity TesterTemperature and Humidity Tester
Test & AnalysisTest & Analysis
Thermal ShockThermal Shock
Time Correrated Single Photon Counting SystemTime Correrated Single Photon Counting System
Track I (2-3 inch)Track I (2-3 inch)
Track II (4-6 inch)Track II (4-6 inch)
Track III (4-6 inch)Track III (4-6 inch)
Track IV (4-6 inch)Track IV (4-6 inch)
Track V (8inch)Track V (8inch)
Track VI (8inch)Track VI (8inch)
Track VII(4-6inch)Track VII(4-6inch)
UV/VIS/IR/THz Spectroscopic SourceUV/VIS/IR/THz Spectroscopic Source
W / Oxide CMPW / Oxide CMP
W / plasma CVDW / plasma CVD
Wafer Backside CleanerWafer Backside Cleaner
Wafer bonder (R&D)Wafer bonder (R&D)
Wafer Bonding SystemWafer Bonding System
Wafer Defect InspectionWafer Defect Inspection
Wafer Laser MarkerWafer Laser Marker
Wafer surface? particle counterWafer surface? particle counter
Wire-bonder (Back-end)Wire-bonder (Back-end)
XPSXPS
XRDXRD
XRD -> FE-XD10 변경XRD -> FE-XD10 변경
XRFXRF
XRFXRF
XRFXRF
4-point Probe #14-point Probe #1
4-point Probe #24-point Probe #2
외부 장비외부 장비
CD-SEMCD-SEM
Contact alignerContact aligner
Contact Aligner (Operator Support)Contact Aligner (Operator Support)
Dry Etcher #3_Non metal_A_ChamberDry Etcher #3_Non metal_A_Chamber
Dry Etcher #3_Non metal_B_ChamberDry Etcher #3_Non metal_B_Chamber
Dry Etcher #5_metal_B_ChamberDry Etcher #5_metal_B_Chamber
Dry Etcher #5_metal_D_ChamberDry Etcher #5_metal_D_Chamber
Dry Etcher #6_metal_A_ChamberDry Etcher #6_metal_A_Chamber
Dry Etcher #6_metal_B_ChamberDry Etcher #6_metal_B_Chamber
Dry Etcher #6_metal_C_ChamberDry Etcher #6_metal_C_Chamber
E-Beam EvaporatorE-Beam Evaporator
ETRI Engineering Machine (개별 R&D장비)ETRI Engineering Machine (개별 R&D장비)
FE-SEMFE-SEM
Film Measurement #1Film Measurement #1
Furnace 11_metalFurnace 11_metal
Furnace 12_Non metalFurnace 12_Non metal
Furnace 13_Non metalFurnace 13_Non metal
Furnace 14_Non metalFurnace 14_Non metal
Furnace 21_Non metalFurnace 21_Non metal
Furnace 22_Non metalFurnace 22_Non metal
Furnace 23_Non metalFurnace 23_Non metal
HDP Dry Etcher_Non metal_PM1_ChamberHDP Dry Etcher_Non metal_PM1_Chamber
HDP Dry Etcher_Non metal_PM2_ChamberHDP Dry Etcher_Non metal_PM2_Chamber
High Ion ImplanterHigh Ion Implanter
ICP Dry Etcher_Non metalICP Dry Etcher_Non metal
ITO Deposition (Operator Support)ITO Deposition (Operator Support)
Laser MarkingLaser Marking
Long Scan ProfilerLong Scan Profiler
Low Temp PECVD (Operator Support)Low Temp PECVD (Operator Support)
LPCVD 24_Non metalLPCVD 24_Non metal
LPCVD 31_Non metalLPCVD 31_Non metal
LPCVD 32_Non metalLPCVD 32_Non metal
LPCVD 33_Non metalLPCVD 33_Non metal
LPCVD 34_Non metalLPCVD 34_Non metal
Microscope #1Microscope #1
Oven #1Oven #1
Oven #2Oven #2
Particle CounterParticle Counter
PECVD #2_metal_A_Chamber (Oxide)PECVD #2_metal_A_Chamber (Oxide)
PECVD #2_metal_B_Chamber (BPSG, TEOS)PECVD #2_metal_B_Chamber (BPSG, TEOS)
PECVD #2_metal_C_Chamber (Nitride, Oxynitride)PECVD #2_metal_C_Chamber (Nitride, Oxynitride)
PECVD #5_metal_A_Chamber (Oxide, Nitride)PECVD #5_metal_A_Chamber (Oxide, Nitride)
PR Strip #1PR Strip #1
PR Strip #2_Non metal_PM1 ChamberPR Strip #2_Non metal_PM1 Chamber
PR Strip #2_Non metal_PM2 ChamberPR Strip #2_Non metal_PM2 Chamber
PR Strip #3_Non metalPR Strip #3_Non metal
Projection alignerProjection aligner
Rapid Thermal AnnealRapid Thermal Anneal
SOG CoaterSOG Coater
Spectroscpic Ellipsometer #3Spectroscpic Ellipsometer #3
Sputter #1_B_Chamber (Mo)Sputter #1_B_Chamber (Mo)
Sputter #1_C_Chamber (Al, Ni, Cr)Sputter #1_C_Chamber (Al, Ni, Cr)
Sputter #2_A2_Chamber (RF Clean)Sputter #2_A2_Chamber (RF Clean)
Sputter #2_A3_Chamber (AlSi)Sputter #2_A3_Chamber (AlSi)
Sputter #2_A5_Chamber (Ti, TiN)Sputter #2_A5_Chamber (Ti, TiN)
Sputter #2_A6_Chamber (Alloy)Sputter #2_A6_Chamber (Alloy)
Sputter #3_B_Chamber (TiW)Sputter #3_B_Chamber (TiW)
Sputter #3_C_Chamber (AlSi)Sputter #3_C_Chamber (AlSi)
Stepper (I-line#11)Stepper (I-line#11)
Stepper (I-line#12)Stepper (I-line#12)
Track System #1Track System #1
Track System #3Track System #3
Wet Station #1_B1_Bath (PR Strip_metal)Wet Station #1_B1_Bath (PR Strip_metal)
Wet Station #1_B2_Bath (PR Strip_non metal)Wet Station #1_B2_Bath (PR Strip_non metal)
Wet Station #1_B3_Bath (PR Develop)Wet Station #1_B3_Bath (PR Develop)
Wet Station #1_D1_Bath(metal) (DI)Wet Station #1_D1_Bath(metal) (DI)
Wet Station #1_D2_Bath(non metal) (DI)Wet Station #1_D2_Bath(non metal) (DI)
Wet Station #2_Non metal_B1_Bath (H3PO4)Wet Station #2_Non metal_B1_Bath (H3PO4)
Wet Station #2_Non metal_B2_Bath (H2SO4)Wet Station #2_Non metal_B2_Bath (H2SO4)
Wet Station #2_Non metal_B3_Bath (LAL1000)Wet Station #2_Non metal_B3_Bath (LAL1000)
Wet Station #2_Non metal_B4_Bath (100:1HF)Wet Station #2_Non metal_B4_Bath (100:1HF)
Wet Station #2_Non metal_B5_Bath (7:1BHF)Wet Station #2_Non metal_B5_Bath (7:1BHF)
Wet Station #2_Non metal_D1_Bath (DI)Wet Station #2_Non metal_D1_Bath (DI)
Wet Station #3_Non metal_B1_Bath (H2SO4)Wet Station #3_Non metal_B1_Bath (H2SO4)
Wet Station #3_Non metal_B2_Bath (SC1)Wet Station #3_Non metal_B2_Bath (SC1)
Wet Station #3_Non metal_B3_Bath (100:1HF)Wet Station #3_Non metal_B3_Bath (100:1HF)
Wet Station #3_Non metal_D1_Bath (DI)Wet Station #3_Non metal_D1_Bath (DI)
Wet Station #4_Non metal_B1_Bath (H2SO4)Wet Station #4_Non metal_B1_Bath (H2SO4)
Wet Station #4_Non metal_B2_Bath (SC1)Wet Station #4_Non metal_B2_Bath (SC1)
Wet Station #4_Non metal_B3_Bath (100:1HF)Wet Station #4_Non metal_B3_Bath (100:1HF)
Wet Station #4_Non metal_B4_Bath (50:1HF)Wet Station #4_Non metal_B4_Bath (50:1HF)
Wet Station #4_Non metal_D1_Bath (DI)Wet Station #4_Non metal_D1_Bath (DI)
Wet Station #5_metal_B1_Bath (LAL1000)Wet Station #5_metal_B1_Bath (LAL1000)
Wet Station #5_metal_B3_Bath (H2SO4)Wet Station #5_metal_B3_Bath (H2SO4)
Wet Station #5_metal_B3_Bath (Metal Etchant)Wet Station #5_metal_B3_Bath (Metal Etchant)
Wet Station #5_metal_B4_Bath (50:1HF)Wet Station #5_metal_B4_Bath (50:1HF)
Wet Station #5_metal_D1_Bath (DI)Wet Station #5_metal_D1_Bath (DI)
Wet Station #5_non metal_D2_Bath (DI)Wet Station #5_non metal_D2_Bath (DI)
Wet Station #6Wet Station #6
Wire Bonding #1Wire Bonding #1
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